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Power Electronics
Power 6U Chassis Core Control Board
Core Features
● Dual-core intelligent control, exceptional performance
It adopts a collaborative architecture featuring an FPGA and a DSP. The FPGA is responsible for high-speed multi-channel data acquisition, logic control, and interface expansion; while the DSP excels in performing complex power system algorithms (protection, measurement, and control). The division of labor is clear and precise, ensuring unparalleled real-time performance.
● Full interface power protocol support
Onboard optical B-code time synchronization, multi-channel Ethernet, and CAN bus—natively supports power standard protocols such as IEC 61850, IEC 60870-5-104, and Modbus, enabling seamless integration into power automation systems.
● High-precision synchronous sampling
Supports 16-bit and higher ADCs, with multi-channel synchronous sampling accuracy up to ±0.1%, meeting the stringent requirements of applications such as power quality monitoring and relay protection.
● Powerful scalability
Provides a high-speed CPCIe expansion bus, enabling the addition of multiple daughter cards for communication, data acquisition, digital I/O, and other functions, thus offering flexible adaptation to various power application scenarios.
● Industrial-grade, high-reliability design
6U European-standard card structure, industrial-grade chip selection, supports wide-temperature operation from -40℃ to +85℃, meeting the stringent environmental and EMC requirements of the power industry.
Email: sales@sengkeda.com
Core specification parameters
| Parameter Category | Detailed indicators |
| FPGA processor | Altera EP3C120F780C8N |
| FPGA logic unit | 119,088 LEs |
| DSP processor | TI TMS320F28335PGFA |
| DSP clock frequency | 150 MHz (with a floating-point unit FPU) |
| System memory | 1 GB DDR3 (on the FPGA side) + 512 MB DDR2 (on the DSP side) |
| Storage | 512 MB SPI NOR Flash + 4 GB eMMC (data storage) |
| ADC sampling | 16-bit resolution, ±0.1% accuracy, ≥ 16 channels of simultaneous sampling |
| Time synchronization accuracy | ≤±1 μs (receiving IRIG-B or PTP protocol) |
| Protocol support | IEC 61850, IEC 104, Modbus, DNP3 |
| Bus standard | 6U CPCIe Standard Board Card Architecture |
| Operating temperature | -40°C ~ +85°C (Industrial Grade) |
| Power supply | +5V & +12V (power supplied via the CPCIe backplane) |
Interface Information
Front-panel interface (for 6U chassis front panel)
| Interface Type | Quantity/Specification | Function Description |
| Management network port | 1x 10/100/1000M RJ45 | With connection/activity indicator lights for local debugging and system management. |
| Business network port | 2x 10/100/1000M RJ45 | For power business data transmission, supports IEC 61850 MMS/GOOSE. |
| Serial interface | 2x RS-232/485 (software-selectable) | Used to connect a debugging terminal or a traditional-compatible modem. |
| USB port | 1x USB 2.0 Type-A | For data export, external keyboards, mice, and more. |
| Status indicator | Multiple LEDs | System power, operation, fault, and network status indicators. |
Onboard internal interface (led out via CPCIe J2/J3/J4/J5 connectors)
| Interface Type | Quantity/Specification | Function Description |
| High-speed expansion bus | PCIe x4 or PCIe x8 | Used to connect other functional boards (IO cards, communication cards) on the backplane. |
| Time synchronization interface | 1x Optical B-code (ST interface) / 1x IRIG-B (TTL) | Receive synchronization signals from the Beidou/GPS clock source to achieve high-precision time synchronization. |
| Industrial bus | 2x CAN 2.0B (isolated) | Connect CAN bus devices such as smart terminals and protective devices. |
| Debugging interface | 1x JTAG (FPGA+DSP) | Program download and debugging for dual-core processors. |
Software and Features
Main functions of FPGA:
- Synchronized Sampling Control and Data Preprocessing for Multi-Channel ADCs.
- Fast response and state management for multi-channel digital I/O (DI/DO).
- The underlying protocols for implementing high-speed communication interfaces (such as the Ethernet MAC layer).
- Logic Protection and Co-processing.
Main functions of DSP:
- Run complex power algorithms (Fourier transform, reactive power compensation, relay protection logic).
- Execute a real-time operating system (such as SYS/BIOS) and perform task scheduling.
- Handle application-layer power protocol stacks (IEC 61850, Modbus).
- System Management and Communication.
Typical application scenarios
- Smart Substation: The core motherboard serving as the communication processing unit at the station control layer or the protection and measurement control device at the bay level.
- New Energy Centralized Control: The master control unit of the AGC/AVC system for wind farms and photovoltaic power plants.
- Distribution Automation: The core processing board of integrated monitoring terminals (DTU/FTU) for distribution networks.
- Power Quality Management: Controller for SVG/APF (Static Var Generator/Active Power Filter).
- Power simulation testing: Power amplifier interface board for the Real-Time Digital Simulator (RTDS).
Keywords：Power 6U Chassis Core Control Board
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Guangzhou SENGKEDA Technology Co., Ltd
Contact: Elaine Huang
Service hotline: +86 20 8792 5274
Email: sales@sengkeda.com
Company Address: Building D, No. 1, Cai Pin Road, Science City, Huangpu District, Guangzhou, Guangdong Province
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